Details

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Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 & CAG762.

 

These materials offer the following features:

• Excellent mechanical properties at elevated temperatures including the lead-free process.
• Low thermal conductivity.
• Excellent machining properties enabling the manufacture of complex design solder pallets.
• Good resistance to chemicals used in modern fluxes.